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| 貨號 | BERGQUIST GAP FILLER TGF 3600 |
| 品牌 | BERGQUIST GAP FILLER TGF 3600 |
| 工作溫度 | -73°C to 260°C |
| 執行標準 | |
| 活性使用期 | |
| 包裝規格 | 支 |
| CAS編號 | |
| 別名 | BERGQUIST GAP FILLER TGF 3600 |
| 有效物質≥ | |
| 固化方式 | |
| 有效期 |
t exhibits ultra high thermal performance and superior softness. This product has low modulus to help relieves CTE stresses in thermal cycling and also provide excellent vertical gap stability. This product can be used for fragile and low stress applications in various fields. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.
Thermal conductivity: 3.6 W/m-K
Ultra low Modulus
Ultra conforming
Easily dispensable
UL94 V-0 compliance
