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CHO-BOND®4660和4669 ONE COMPONENT FLLEXIBLE導電聚異丁烯密封劑。 CHO-BOND 4660是一種鍍銀銅填充的單組分導電聚異丁烯。 它設計用作電氣外殼上的圓角，間隙填充物和接縫密封劑，用于EMI屏蔽或電氣接地。
CHO-BOND® 4660 and 4669 ONE COMPONENT FLEXIBLE ELECTRICALLY CONDUCTIVE POLYISOBUTYLENE SEALANT. CHO-BOND 4660 is a silver-plated copper filled, one-component conductive polyisobutylene. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.